Common fault analysis and structural improvement of Dual plate wafer check valve

1. In practical engineering applications, the damage of Dual plate wafer check valves is caused by many reasons.

(1) Under the impact force of the medium, the contact area between the connecting part and the positioning rod is too small, resulting in stress concentration per unit area, and the Dual plate wafer check valve is damaged due to the excessive stress value.

(2) In actual work, if the pressure of the pipeline system is unstable, the connection between the disc of the Dual plate wafer check valve and the positioning rod will vibrate back and forth within a certain rotation angle around the positioning rod, resulting in the disc and the positioning rod. Friction occurs between them, which aggravates the damage of the connection part.

2. Improvement plan

According to the failure form of the Dual plate wafer check valve, the structure of the valve disc and the connection part between the valve disc and the positioning rod can be improved to eliminate the stress concentration at the connection part, reduce the probability of failure of the Dual plate wafer check valve in use, and prolong the check period. service life of the valve. The disc of the Dual plate wafer check valve and the connection between the disc and the positioning rod are respectively improved and designed, and the finite element software is used to simulate and analyze, and an improved scheme to solve the problem of stress concentration is proposed.

(1) Improve the form of the disc, design grooves on the disc of the check valve to reduce the quality of the disc, thereby changing the force distribution of the disc, and observe the force of the disc and the connection between the disc and the positioning rod. strength situation. This solution can make the force of the valve disc more uniform, and effectively improve the stress concentration of the Dual plate wafer check valve.

(2) Improve the form of the disc, and carry out an arc-shaped thickening design on the back of the check valve disc to improve the strength of the disc, thereby changing the force distribution of the disc, making the force of the disc more uniform, and improving the butterfly check Stress concentration of the valve.

(3) Improve the form of the connection part between the valve disc and the positioning rod, lengthen and thicken the connection part, and increase the contact area between the connection part and the back of the valve disc, thereby improving the stress concentration of the Dual plate wafer check valve.